Part Details for MAX19692EXW+D by Maxim Integrated Products
Overview of MAX19692EXW+D by Maxim Integrated Products
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Applications
Education and Research
Industrial Automation
Financial Technology (Fintech)
Electronic Manufacturing
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DBL5W5P543A40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB. | |
DEL2V2P543H40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness. | |
DC8W8P500H30LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness. |
Part Details for MAX19692EXW+D
MAX19692EXW+D CAD Models
MAX19692EXW+D Part Data Attributes
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MAX19692EXW+D
Maxim Integrated Products
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Datasheet
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MAX19692EXW+D
Maxim Integrated Products
12-Bit, 2.3Gsps Multi-Nyquist DAC, CSBGA;169 pin;123.2 mm², Temp: -40°C to +85°C, Lead Free
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
Package Description | CSBGA-169 | |
Reach Compliance Code | compliant | |
Converter Type | D/A CONVERTER | |
Input Bit Code | OFFSET BINARY | |
Input Format | PARALLEL, WORD | |
JESD-30 Code | S-PBGA-B169 | |
Length | 11 mm | |
Linearity Error-Max (EL) | 0.031738% | |
Number of Bits | 12 | |
Number of Functions | 1 | |
Number of Terminals | 169 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA169,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.5 mm | |
Settling Time-Nom (tstl) | 0.0045 µs | |
Supply Current-Max | 117 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 11 mm |