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Part Details for MAX77863AEWJ+T by Analog Devices Inc
Overview of MAX77863AEWJ+T by Analog Devices Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for MAX77863AEWJ+T
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
700-MAX77863AEWJ+T
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Mouser Electronics | Power Management Specialized - PMIC PMIC for Multi-Core Applications Processor RoHS: Compliant | 2398 |
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$5.0900 / $9.1300 | Buy Now |
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Analog Devices Inc | PMIC for Multi-Core Applicatio Min Qty: 2000 Package Multiple: 1 | 24000 |
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$4.9894 / $6.5600 | Buy Now |
|
DISTI #
3582071
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Farnell | POWER MANAGEMENT IC, -40 TO 85DEG C RoHS: Compliant Min Qty: 2000 Lead time: 11 Weeks, 1 Days Container: Reel | 0 |
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$5.0617 | Buy Now |
Part Details for MAX77863AEWJ+T
MAX77863AEWJ+T CAD Models
MAX77863AEWJ+T Part Data Attributes:
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MAX77863AEWJ+T
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
MAX77863AEWJ+T
Analog Devices Inc
Complete System PMIC, Featuring 13 Regulators, 8 GPIOs, RTC, and Flexible Power Sequencing for Multicore Applications, 90-WLCSP-N/A, 90 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 90-WLCSP-N/A | |
| Package Description | WLP-90 | |
| Pin Count | 90 | |
| Manufacturer Package Code | 90-WLCSP-N/A | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2019-10-31 | |
| Samacsys Manufacturer | Analog Devices | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT | |
| JESD-30 Code | R-PBGA-B90 | |
| JESD-609 Code | e2 | |
| Length | 4.085 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 13 | |
| Number of Functions | 1 | |
| Number of Terminals | 90 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA90,.9X10,16 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.69 mm | |
| Supply Current-Max (Isup) | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.6 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Threshold Voltage-Nom | +5.85V | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3.775 mm |