Part Details for MAX97200BEWC+T by Analog Devices Inc
Results Overview of MAX97200BEWC+T by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MAX97200BEWC+T
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX97200BEWC+T
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Mouser Electronics | Audio Amplifiers Low-Power, Low-Offset, Dual Mode, Class RoHS: Compliant | 1643 |
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$0.7750 / $2.6700 | Buy Now |
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Analog Devices Inc | Low-Power, Low-Offset, Dual Mo Min Qty: 2500 Package Multiple: 1 | 12500 |
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$0.5900 / $2.6700 | Buy Now |
US Tariff Estimator: MAX97200BEWC+T by Analog Devices Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for MAX97200BEWC+T
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MAX97200BEWC+T Part Data Attributes
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MAX97200BEWC+T
Analog Devices Inc
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Datasheet
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MAX97200BEWC+T
Analog Devices Inc
0.045W, 2 Channel(s), 1 Func, BICMOS, PBGA12
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 12-WLCSP-N/A | |
| Package Description | Vfbga, Bga12,3x4,16 | |
| Pin Count | 12 | |
| Manufacturer Package Code | 12-WLCSP-N/A | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Date Of Intro | 2010-02-17 | |
| Consumer IC Type | Class H Audio Amplifier | |
| Gain | ||
| JESD-30 Code | R-PBGA-B12 | |
| Length | 1.68 Mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Power-Nom | 0.045 W | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA12,3X4,16 | |
| Package Shape | Rectangular | |
| Package Style | Grid Array, Very Thin Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.69 Mm | |
| Supply Voltage-Max (Vsup) | 1.98 V | |
| Supply Voltage-Min (Vsup) | 1.62 V | |
| Surface Mount | Yes | |
| Technology | Bicmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.4 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1.3 Mm |