There are no models available for this part yet.
Overview of MC9S08RE16CFJ by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for MC9S08RE16CFJ by Freescale Semiconductor
Part Data Attributes for MC9S08RE16CFJ by Freescale Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code
|
QFP
|
Package Description
|
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
|
Pin Count
|
32
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.31.00.01
|
Has ADC
|
NO
|
Address Bus Width
|
|
Bit Size
|
8
|
Clock Frequency-Max
|
16 MHz
|
DAC Channels
|
NO
|
DMA Channels
|
NO
|
External Data Bus Width
|
|
JESD-30 Code
|
S-PQFP-G32
|
JESD-609 Code
|
e0
|
Length
|
7 mm
|
Moisture Sensitivity Level
|
3
|
Number of I/O Lines
|
27
|
Number of Terminals
|
32
|
On Chip Program ROM Width
|
8
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
PWM Channels
|
YES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LQFP
|
Package Equivalence Code
|
QFP32,.35SQ,32
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK, LOW PROFILE
|
Peak Reflow Temperature (Cel)
|
240
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
1024
|
ROM (words)
|
16384
|
ROM Programmability
|
FLASH
|
Seated Height-Max
|
1.6 mm
|
Speed
|
8 MHz
|
Supply Current-Max
|
4.8 mA
|
Supply Voltage-Max
|
3.6 V
|
Supply Voltage-Min
|
2 V
|
Supply Voltage-Nom
|
2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
7 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|
Alternate Parts for MC9S08RE16CFJ
This table gives cross-reference parts and alternative options found for MC9S08RE16CFJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC9S08RE16CFJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MC9S08RE16CFJE | MICROCONTROLLER | NXP Semiconductors | MC9S08RE16CFJ vs MC9S08RE16CFJE |
MC9S08RE16FJ | 8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP32, LQFP-32 | Motorola Mobility LLC | MC9S08RE16CFJ vs MC9S08RE16FJ |
MC9S08RE16FJE | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 | Rochester Electronics LLC | MC9S08RE16CFJ vs MC9S08RE16FJE |
MC9S08RE16FJE | MICROCONTROLLER | NXP Semiconductors | MC9S08RE16CFJ vs MC9S08RE16FJE |
MC9S08RE16CFJ | 8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP32, LQFP-32 | Motorola Mobility LLC | MC9S08RE16CFJ vs MC9S08RE16CFJ |
MC9S08RE16FJ | 8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32 | Freescale Semiconductor | MC9S08RE16CFJ vs MC9S08RE16FJ |