Part Details for MCIMX31LDVMN5D by Rochester Electronics LLC
Overview of MCIMX31LDVMN5D by Rochester Electronics LLC
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Part Details for MCIMX31LDVMN5D
MCIMX31LDVMN5D CAD Models
MCIMX31LDVMN5D Part Data Attributes
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MCIMX31LDVMN5D
Rochester Electronics LLC
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MCIMX31LDVMN5D
Rochester Electronics LLC
32-BIT, 532MHz, MICROPROCESSOR, PBGA473, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 | |
| Pin Count | 473 | |
| Reach Compliance Code | unknown | |
| Additional Feature | UNAVAILABLE FOR IMPORT OR SALE IN US | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 75 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B473 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 473 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.54 mm | |
| Speed | 532 MHz | |
| Supply Voltage-Max | 1.65 V | |
| Supply Voltage-Min | 1.52 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |