Part Details for MD27C256-25/B by Intel Corporation
Overview of MD27C256-25/B by Intel Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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MD27C256-15/B | Rochester Electronics LLC | MD27C256-15/B | |
MD27C256-20/B | Rochester Electronics LLC | Replacement for Intel part number MD27C256-20. Buy from authorized manufacturer Rochester Electronics. | |
MD27C256-25/B | Rochester Electronics LLC | UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, JLCC-32 |
Price & Stock for MD27C256-25/B
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 93 |
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$75.9000 / $89.7000 | Buy Now | |
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Quest Components | 22 |
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$84.0000 / $91.0000 | Buy Now | |
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Quest Components | 4 |
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$149.0400 / $165.6000 | Buy Now | |
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Quest Components | 2 |
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$132.1952 / $139.1528 | Buy Now |
Part Details for MD27C256-25/B
MD27C256-25/B CAD Models
MD27C256-25/B Part Data Attributes
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MD27C256-25/B
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
MD27C256-25/B
Intel Corporation
UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, JLCC-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Part Package Code | QFJ | |
Package Description | CERAMIC, JLCC-32 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-CQCC-J32 | |
Length | 15.04 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCJ | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.2418 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.557 mm |
Alternate Parts for MD27C256-25/B
This table gives cross-reference parts and alternative options found for MD27C256-25/B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MD27C256-25/B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
5962-8606302ZX | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, JLCC-32 | QP Semiconductor | MD27C256-25/B vs 5962-8606302ZX |
AT27C256R-25KC | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | MD27C256-25/B vs AT27C256R-25KC |
5962-8606302ZX | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, JLCC-32 | Teledyne e2v | MD27C256-25/B vs 5962-8606302ZX |
FT27C256R-25MM/883 | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Force Technologies Ltd | MD27C256-25/B vs FT27C256R-25MM/883 |
AT27C256R-25KI | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | MD27C256-25/B vs AT27C256R-25KI |