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MD27C256-25/B
Rochester Electronics LLC
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$76.2093 | No | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-J32 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.2418 mm | 15.04 mm | 11.557 mm | ROCHESTER ELECTRONICS LLC | CERAMIC, JLCC-32 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||
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MD27C256-25/B
Intel Corporation
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-J32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.2418 mm | 15.04 mm | 11.557 mm | INTEL CORP | CERAMIC, JLCC-32 | compliant | 3A001.A.2.C | 8542.32.00.61 | QFJ | 32 |