Part Details for MM54C200D by National Semiconductor Corporation
Overview of MM54C200D by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Part Details for MM54C200D
MM54C200D CAD Models
MM54C200D Part Data Attributes
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MM54C200D
National Semiconductor Corporation
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Datasheet
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MM54C200D
National Semiconductor Corporation
IC 256 X 1 STANDARD SRAM, CDIP16, DIP-16, Static RAM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | DIP, DIP16,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 900 ns | |
Additional Feature | INTERNAL ADDRESS REGISTER | |
I/O Type | SEPARATE | |
JESD-30 Code | R-CDIP-T16 | |
JESD-609 Code | e0 | |
Memory Density | 256 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256X1 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.191 mm | |
Supply Voltage-Max (Vsup) | 15 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for MM54C200D
This table gives cross-reference parts and alternative options found for MM54C200D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MM54C200D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MM74C200N | IC 256 X 1 STANDARD SRAM, 1100 ns, PDIP16, DIP-16, Static RAM | National Semiconductor Corporation | MM54C200D vs MM74C200N |
N74201F | IC 256 X 1 STANDARD SRAM, 50 ns, CDIP16, Static RAM | NXP Semiconductors | MM54C200D vs N74201F |
N74S201B | 256X1 STANDARD SRAM, 50ns, PDIP16 | Philips Semiconductors | MM54C200D vs N74S201B |
N74201F | 256X1 STANDARD SRAM, 50ns, CDIP16 | Philips Semiconductors | MM54C200D vs N74201F |
N74201B | 256X1 STANDARD SRAM, 50ns, PDIP16 | Philips Semiconductors | MM54C200D vs N74201B |
N82S16N | IC 256 X 1 CACHE SRAM, 50 ns, PDIP16, Static RAM | NXP Semiconductors | MM54C200D vs N82S16N |
N74200F | 256X1 STANDARD SRAM, 50ns, CDIP16 | Philips Semiconductors | MM54C200D vs N74200F |
MSISAM27LS00APC | Standard SRAM, 256X1, 35ns, CMOS, CDIP16 | AMD | MM54C200D vs MSISAM27LS00APC |
F10411DC | Standard SRAM, 256X1, 35ns, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Fairchild Semiconductor Corporation | MM54C200D vs F10411DC |
N82LS16N | IC 256 X 1 CACHE SRAM, 40 ns, PDIP16, Static RAM | NXP Semiconductors | MM54C200D vs N82LS16N |