Part Details for MPC8541VTAPF by Rochester Electronics LLC
Overview of MPC8541VTAPF by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for MPC8541VTAPF
MPC8541VTAPF CAD Models
MPC8541VTAPF Part Data Attributes:
|
|
MPC8541VTAPF
Rochester Electronics LLC
Buy Now
Datasheet
|
Compare Parts:
MPC8541VTAPF
Rochester Electronics LLC
32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
|
| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783 | |
| Pin Count | 783 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 64 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 166 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | R-PBGA-B783 | |
| JESD-609 Code | e2 | |
| Length | 29 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 3.75 mm | |
| Speed | 833 MHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN COPPER/TIN SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |