Part Details for MT29F64G08AKCBBH2-12:B by Micron Technology Inc
Overview of MT29F64G08AKCBBH2-12:B by Micron Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MT29F64G08AKCBBH2-12:B
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 1 | 3792 |
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$34.4400 / $42.0000 | Buy Now |
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Bristol Electronics | Min Qty: 1 | 4004 |
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$34.4400 / $42.0000 | Buy Now |
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Quest Components | 3203 |
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$35.0000 / $45.5000 | Buy Now | |
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Quest Components | 3033 |
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$35.0000 / $45.5000 | Buy Now |
Part Details for MT29F64G08AKCBBH2-12:B
MT29F64G08AKCBBH2-12:B CAD Models
MT29F64G08AKCBBH2-12:B Part Data Attributes
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MT29F64G08AKCBBH2-12:B
Micron Technology Inc
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Datasheet
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MT29F64G08AKCBBH2-12:B
Micron Technology Inc
Flash, 8GX8, PBGA100, 12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | 12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 18 mm | |
Memory Density | 68719476736 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 8589934592 words | |
Number of Words Code | 8000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 2.7 V | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Type | SLC NAND TYPE | |
Width | 12 mm |