Memory Flash Memories MT29F8G16ADADAH4-IT:D

MT29F8G16ADADAH4-IT:D by
Micron Technology Inc

Description: Flash, 512MX16, 25ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, VFBGA-63

Overview of MT29F8G16ADADAH4-IT:D by Micron Technology Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Part #	Manufacturer	Description
DBL5W5P543A40LF	Amphenol Communications Solutions	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB.
DEL2V2P543H40LF	Amphenol Communications Solutions	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness.
DC8W8P500H30LF	Amphenol Communications Solutions	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness.

	Part #	Manufacturer	Description	Stock	Price	Buy
	MT29F8G16ADADAH4-IT:D DISTI # 80AH7839	Newark	Flash Memory, 8Gbit, -40 To 85Deg C, Flash Memory Type:Slc Nand, Memory Configuration:512M X 16Bit, Interfaces:Parallel, Ic Case/Package:Vfbga, No. Of Pins:63Pins, Clock Frequency Max:50Mhz, Access Time:-, Supply Voltage Min:2.7V Rohs Compliant: Yes \|Micron MT29F8G16ADADAH4-IT:D RoHS: Compliant Min Qty: 1260 Package Multiple: 1 Date Code: 0 Container: Bulk	0			Buy Now

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Show differences only	MT29F8G16ADADAH4-IT:D Micron Technology Inc Buy Now	part-to-be-compared Micron Technology Inc Buy Now
-	-	-
Pbfree Code	Yes
Rohs Code	Yes
Part Life Cycle Code	Obsolete
Ihs Manufacturer	MICRON TECHNOLOGY INC
Package Description	VFBGA, BGA63,10X12,32
Reach Compliance Code	compliant
ECCN Code	EAR99
HTS Code	8542.32.00.51
Samacsys Manufacturer	Micron
Access Time-Max	25 ns
Command User Interface	YES
Data Polling	NO
JESD-30 Code	R-PBGA-B63
Length	11 mm
Memory Density	8589934592 bit
Memory IC Type	FLASH
Memory Width	16
Number of Functions	1
Number of Sectors/Size	8K
Number of Terminals	63
Number of Words	536870912 words
Number of Words Code	512000000
Operating Mode	ASYNCHRONOUS
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Organization	512MX16
Package Body Material	PLASTIC/EPOXY
Package Code	VFBGA
Package Equivalence Code	BGA63,10X12,32
Package Shape	RECTANGULAR
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size	1K words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	260
Programming Voltage	3.3 V
Qualification Status	Not Qualified
Ready/Busy	YES
Seated Height-Max	1 mm
Sector Size	64K
Standby Current-Max	0.0001 A
Supply Current-Max	0.035 mA
Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	INDUSTRIAL
Terminal Form	BALL
Terminal Pitch	0.8 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Toggle Bit	NO
Type	SLC NAND TYPE
Width	9 mm

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