Part Details for MT41K256M16TW-107:P/TR by Micron Technology Inc
Overview of MT41K256M16TW-107:P/TR by Micron Technology Inc
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Applications
Computing and Data Storage
Part Details for MT41K256M16TW-107:P/TR
MT41K256M16TW-107:P/TR CAD Models
MT41K256M16TW-107:P/TR Part Data Attributes
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MT41K256M16TW-107:P/TR
Micron Technology Inc
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Datasheet
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MT41K256M16TW-107:P/TR
Micron Technology Inc
DDR DRAM,
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | , | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | MULTI BANK PAGE BURST | |
Clock Frequency-Max (fCLK) | 934.5 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 8 | |
JESD-30 Code | R-PBGA-B96 | |
JESD-609 Code | e1 | |
Length | 14 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 256MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA96,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 8 | |
Standby Current-Max | 0.012 A | |
Supply Current-Max | 0.147 mA | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 8 mm |