Datasheets
MT41K2G4RKB-107:P by: Micron Technology Inc

DDR3L DRAM, 2GX4, CMOS, PBGA78, FBGA-78

Part Details for MT41K2G4RKB-107:P by Micron Technology Inc

Overview of MT41K2G4RKB-107:P by Micron Technology Inc

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Price & Stock for MT41K2G4RKB-107:P

Part # Distributor Description Stock Price Buy
DISTI # 80AH8022
Newark Dram, 2G X 4Bit, 0 To 95Deg C, Dram Type:Ddr3L, Memory Configuration:2G X 4Bit, Clock Frequency Max:933Mhz, Ic Case/Package:Tfbga, No. Of Pins:78Pins, Supply Voltage Nom:1.35V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Micron MT41K2G4RKB-107:P RoHS: Compliant Min Qty: 1440 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
DISTI # MT41K2G4RKB-107:P
Avnet Americas SDRAM Chip 8Gb 2G x 4-bit DDR3L 78-Ball FBGA - Trays (Alt: MT41K2G4RKB-107:P) RoHS: Not Compliant Min Qty: 1440 Package Multiple: 1440 Lead time: 18 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # MT41K2G4RKB-107:P
Avnet Americas - Tape and Reel (Alt: MT41K2G4RKB-107:P) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 18 Weeks, 0 Days Container: Reel 0
RFQ
DISTI # 340-361570-TRAY
Mouser Electronics DRAM DDR3 8G 2GX4 FBGA DDP RoHS: Compliant 0
  • 1,440 $20.2600
$20.2600 Order Now

Part Details for MT41K2G4RKB-107:P

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MT41K2G4RKB-107:P Part Data Attributes

MT41K2G4RKB-107:P Micron Technology Inc
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MT41K2G4RKB-107:P Micron Technology Inc DDR3L DRAM, 2GX4, CMOS, PBGA78, FBGA-78
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description FBGA-78
Reach Compliance Code unknown
Factory Lead Time 18 Weeks
Samacsys Manufacturer Micron
Access Mode DUAL BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 933 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B78
Length 10.5 mm
Memory Density 8589934592 bit
Memory IC Type DDR3L DRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 78
Number of Words 2147483648 words
Number of Words Code 2000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 2GX4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.022 A
Supply Current-Max 0.163 mA
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm

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