Part Details for MT47H32M16CC-37E:B by Micron Technology Inc
Overview of MT47H32M16CC-37E:B by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MT47H32M16CC-37E:B
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | SDRAM, DDR, 32M x 16, 84 Pin, Plastic, BGA | 4 |
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$10.8944 / $14.8560 | Buy Now |
Part Details for MT47H32M16CC-37E:B
MT47H32M16CC-37E:B CAD Models
MT47H32M16CC-37E:B Part Data Attributes
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MT47H32M16CC-37E:B
Micron Technology Inc
Buy Now
Datasheet
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MT47H32M16CC-37E:B
Micron Technology Inc
DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 12 X 12.50 MM, ROHS COMPLIANT, FBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA84,9X15,32 | |
| Pin Count | 84 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Samacsys Manufacturer | Micron | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.5 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 266 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| JESD-609 Code | e1 | |
| Length | 12.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.007 A | |
| Supply Current-Max | 0.34 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm |
Alternate Parts for MT47H32M16CC-37E:B
This table gives cross-reference parts and alternative options found for MT47H32M16CC-37E:B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT47H32M16CC-37E:B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT47H32M16HW-37E:F | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16HW-37E:F |
| MT47H32M16HW-37EL:F | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16HW-37EL:F |
| MT47H32M16GC-37E:B | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 12 X 12.50 MM, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16GC-37E:B |
| MT47H32M16GC-37EL:B | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 12 X 12.50 MM, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16GC-37EL:B |
| MT47H32M16BN-37E:D | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 10 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16BN-37E:D |
| MT47H32M16FN-37EL:D | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 10 X 12.50 MM, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16FN-37EL:D |
| MT47H32M16CC-37EL:B | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 12 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16CC-37EL:B |
| MT47H32M16HR-37E:F | DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84 | Micron Technology Inc | MT47H32M16CC-37E:B vs MT47H32M16HR-37E:F |