Datasheets
MX25R3235FBDIL0 by: Macronix International Co Ltd

Flash, 8MX4, PBGA12, WLCSP-12

Part Details for MX25R3235FBDIL0 by Macronix International Co Ltd

Overview of MX25R3235FBDIL0 by Macronix International Co Ltd

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for MX25R3235FBDIL0

Part # Distributor Description Stock Price Buy
DISTI # MX25R3235FBDIL0-ND
DigiKey IC FLASH 32MBIT SPI/QUAD 12WLCSP Min Qty: 6000 Lead time: 10 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 6,000 $0.7522
$0.7522 Buy Now
DISTI # MX25R3235FBDIL0
Avnet Americas NOR Flash Serial-SPI 1.8/2.5/3.3V 32Mb 33/16/8M 1/2/4Bit 12ns/10ns 12-Pin WLCSP - Tape and Reel (Alt: MX25R3235FBDIL0) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 10 Weeks, 0 Days Container: Reel 0
  • 1 $0.6100
$0.6100 Buy Now

Part Details for MX25R3235FBDIL0

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MX25R3235FBDIL0 Part Data Attributes

MX25R3235FBDIL0 Macronix International Co Ltd
Buy Now Datasheet
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MX25R3235FBDIL0 Macronix International Co Ltd Flash, 8MX4, PBGA12, WLCSP-12
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD
Package Description WLCSP-12
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Factory Lead Time 10 Weeks
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 80 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B12
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 12
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA12,5X7,14/8
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V
Seated Height-Max 0.52 mm
Serial Bus Type SPI
Standby Current-Max 0.000024 A
Supply Current-Max 0.006 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.35 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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