Part Details for N25Q256A33E1241F by Micron Technology Inc
Overview of N25Q256A33E1241F by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for N25Q256A33E1241F
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
N25Q256A33E1241F
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Avnet Americas | NOR Flash Serial-SPI 3.3V 256Mbit 256M/128M/64M x 1bit/2bit/4bit 8ns/7ns 24-Pin TPBGA T/R - Tape and Reel (Alt: N25Q256A33E1241F) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 18 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
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DISTI #
N25Q256A33E1241F
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Avnet Americas | NOR Flash Serial-SPI 3.3V 256Mbit 256M/128M/64M x 1bit/2bit/4bit 8ns/7ns 24-Pin TPBGA T/R - Tape and Reel (Alt: N25Q256A33E1241F) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 18 Weeks, 0 Days Container: Reel | 0 |
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RFQ |
Part Details for N25Q256A33E1241F
N25Q256A33E1241F CAD Models
N25Q256A33E1241F Part Data Attributes:
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N25Q256A33E1241F
Micron Technology Inc
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Datasheet
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N25Q256A33E1241F
Micron Technology Inc
Flash, 256MX1, PBGA24, TBGA-24
|
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | TBGA-24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 18 Weeks | |
| Clock Frequency-Max (fCLK) | 108 MHz | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |