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OMAP3530ECUSA by:

Applications Processor 423-FCCSP -40 to 105

Part Details for OMAP3530ECUSA by Texas Instruments

Overview of OMAP3530ECUSA by Texas Instruments

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Applications Consumer Electronics Industrial Automation Agriculture Technology Electronic Manufacturing Robotics and Drones

Price & Stock for OMAP3530ECUSA

Part # Distributor Description Stock Price Buy
DISTI # 2156-OMAP3530ECUSA-ND
DigiKey IC MPU OMAP-35XX 600MHZ 423FCBGA Min Qty: 6 Lead time: 6 Weeks Container: Bulk MARKETPLACE PRODUCT 1437
In Stock
  • 6 $50.8500
$50.8500 Buy Now
DISTI # 296-37714-ND
DigiKey IC MPU OMAP-35XX 600MHZ 423FCBGA Min Qty: 6 Lead time: 6 Weeks Container: Tray Temporarily Out of Stock
  • 90 $49.4173
$49.4173 Buy Now
DISTI # 595-OMAP3530ECUSA
Mouser Electronics Processors - Application Specialized Applications Proc RoHS: Compliant 0
  • 1 $58.6500
  • 10 $55.1100
  • 25 $53.3300
  • 50 $49.4200
  • 90 $49.4100
$49.4100 / $58.6500 Order Now
Rochester Electronics OMAP 3 Arch, DSP + ARM Cortex-A8 Core, 32-Bit, 600MHz, PBGA423 RoHS: Compliant Status: Active Min Qty: 1 1437
  • 1 $51.3300
  • 25 $50.3100
  • 100 $48.2500
  • 500 $46.2000
  • 1,000 $43.6300
$43.6300 / $51.3300 Buy Now
Ameya Holding Limited IC MPU OMAP-35XX 600MHZ 423FCBGA 835
RFQ
DISTI # SMC-OMAP3530ECUSA
Sensible Micro Corporation Ic Mpu Omap-35Xx 600Mhz 423Fcbga RoHS: Not Compliant Min Qty: 25 Lead time: 0 Weeks, 1 Days 40
RFQ
Chip1Cloud OMAP3530/25 Applications Processor: OMAP 3 Architecture 5650
RFQ
Perfect Parts Corporation   1045
RFQ

Part Details for OMAP3530ECUSA

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OMAP3530ECUSA Part Data Attributes

OMAP3530ECUSA Texas Instruments
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OMAP3530ECUSA Texas Instruments Applications Processor 423-FCCSP -40 to 105
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Pin Count 423
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
JESD-30 Code S-PBGA-B423
JESD-609 Code e1
Length 16 mm
Moisture Sensitivity Level 4
Number of Terminals 423
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA423,24X24,25
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Speed 720 MHz
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for OMAP3530ECUSA

This table gives cross-reference parts and alternative options found for OMAP3530ECUSA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of OMAP3530ECUSA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
OMAP3530ECUS Applications Processor 423-FCCSP 0 to 90 Texas Instruments OMAP3530ECUSA vs OMAP3530ECUS
Part Number Description Manufacturer Compare
OMAP3530ECUS Applications Processor 423-FCCSP 0 to 90 Texas Instruments OMAP3530ECUSA vs OMAP3530ECUS

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