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PM8607B1-F3EI by:

NVMe2016

Part Details for PM8607B1-F3EI by Microchip Technology Inc

Overview of PM8607B1-F3EI by Microchip Technology Inc

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Applications Consumer Electronics Energy and Power Systems Renewable Energy Automotive

Price & Stock for PM8607B1-F3EI

Part # Distributor Description Stock Price Buy
DISTI # 95AC2030
Newark Afm-700 Supercap Kit, 1085 Fbga 27X27X2.23Mm Tray Rohs Compliant: Yes |Microchip PM8607B1-F3EI Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
DISTI # PM8607B1-F3EI
Avnet Americas PCIe Flash Controller 16 Channel XTS-AES-256 1085-Ball FCBGA - Trays (Alt: PM8607B1-F3EI) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # PM8607B1-F3EI
Microchip Technology Inc NVMe2016, Projected EOL: 2048-10-03 RoHS: Compliant pbFree: Yes 3110

Alternates Available
  • 1 $341.2200
  • 25 $284.2800
  • 100 $258.5300
$258.5300 / $341.2200 Buy Now
Bristol Electronics   24
RFQ
DISTI # PM8607B1-F3EI
Avnet Americas PCIe Flash Controller 16 Channel XTS-AES-256 1085-Ball FCBGA - Trays (Alt: PM8607B1-F3EI) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray 0
RFQ
Ameya Holding Limited   1440
RFQ
DISTI # PM8607B1-F3EI
Avnet Americas PCIe Flash Controller 16 Channel XTS-AES-256 1085-Ball FCBGA - Trays (Alt: PM8607B1-F3EI) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 12 Weeks, 0 Days Container: Tray 0
RFQ
NAC   RoHS: Compliant Min Qty: 1 Package Multiple: 1 0
RFQ

Part Details for PM8607B1-F3EI

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PM8607B1-F3EI Part Data Attributes

PM8607B1-F3EI Microchip Technology Inc
Buy Now Datasheet
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PM8607B1-F3EI Microchip Technology Inc NVMe2016
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description FBGA-1085
Reach Compliance Code compliant
Factory Lead Time 12 Weeks
Date Of Intro 2020-12-14
JESD-30 Code R-PBGA-B1085
Memory IC Type FLASH
Number of Functions 1
Number of Terminals 1085
Operating Temperature-Max 115 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Position BOTTOM
Type NAND TYPE

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