Datasheets
RC28F256P30TFA by:

Flash, 16MX16, 100ns, PBGA64, BGA-64

Part Details for RC28F256P30TFA by Micron Technology Inc

Overview of RC28F256P30TFA by Micron Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for RC28F256P30TFA

Part # Distributor Description Stock Price Buy
Bristol Electronics   616
RFQ

Part Details for RC28F256P30TFA

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RC28F256P30TFA Part Data Attributes

RC28F256P30TFA Micron Technology Inc
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RC28F256P30TFA Micron Technology Inc Flash, 16MX16, 100ns, PBGA64, BGA-64
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description BGA-64
Pin Count 64
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 100 ns
Additional Feature ASYNCHRONOUS READ MODE
Alternate Memory Width 16
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B64
JESD-609 Code e0
Length 13 mm
Memory Density 268435456 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 4,255
Number of Terminals 64
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Programming Voltage 1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Sector Size 16K,64K
Standby Current-Max 0.00021 A
Supply Current-Max 0.031 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD SILVER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Toggle Bit NO
Type NOR TYPE
Width 10 mm

Alternate Parts for RC28F256P30TFA

This table gives cross-reference parts and alternative options found for RC28F256P30TFA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RC28F256P30TFA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
RC28F256P30TFF Flash, 16MX16, 17ns, PBGA64, BGA-64 Micron Technology Inc RC28F256P30TFA vs RC28F256P30TFF
PC28F256P30TF Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64 Micron Technology Inc RC28F256P30TFA vs PC28F256P30TF
Part Number Description Manufacturer Compare
PC28F256P30TF Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64 Micron Technology Inc RC28F256P30TFA vs PC28F256P30TF
K8C5415ETM-FC1F Flash, 16MX16, 100ns, PBGA167, 10.5 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 Samsung Semiconductor RC28F256P30TFA vs K8C5415ETM-FC1F
K8C5515ETM-DE1F Flash, 16MX16, 100ns, PBGA167, 10.5 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-167 Samsung Semiconductor RC28F256P30TFA vs K8C5515ETM-DE1F
K8C5415ETM-FE1F Flash, 16MX16, 100ns, PBGA167, 10.5 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167 Samsung Semiconductor RC28F256P30TFA vs K8C5415ETM-FE1F
RC28F256P30TFF Flash, 16MX16, 17ns, PBGA64, BGA-64 Micron Technology Inc RC28F256P30TFA vs RC28F256P30TFF

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