Part Details for S1C6S3B2F by Epson Electronics America Inc
Overview of S1C6S3B2F by Epson Electronics America Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for S1C6S3B2F
S1C6S3B2F CAD Models
S1C6S3B2F Part Data Attributes
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S1C6S3B2F
Epson Electronics America Inc
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Datasheet
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S1C6S3B2F
Epson Electronics America Inc
4-BIT, MROM, 0.032MHz, MICROCONTROLLER, PQFP80, PLASTIC, QFP5-80
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SEIKO EPSON CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 80 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | NO | |
| Additional Feature | DEVICE IS ALSO AVAILABLE IN A 80 PIN SQUARE QFP14 PACKAGE; OPERATES WITH A -1.1V TO -3.6V SUPPLY | |
| Address Bus Width | ||
| Bit Size | 4 | |
| Clock Frequency-Max | 0.032 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PQFP-G80 | |
| JESD-609 Code | e6 | |
| Length | 20 mm | |
| Number of I/O Lines | 21 | |
| Number of Terminals | 80 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| ROM Programmability | MROM | |
| Seated Height-Max | 3.4 mm | |
| Speed | 0.032 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |