Part Details for S1C6S3N2D by Epson Electronics America Inc
Overview of S1C6S3N2D by Epson Electronics America Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S1C6S3N2D
S1C6S3N2D CAD Models
S1C6S3N2D Part Data Attributes
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S1C6S3N2D
Epson Electronics America Inc
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Datasheet
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S1C6S3N2D
Epson Electronics America Inc
4-BIT, MROM, 0.032MHz, MICROCONTROLLER, UUC79, DIE-79
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | SEIKO EPSON CORP | |
Part Package Code | DIE | |
Package Description | DIE, | |
Pin Count | 79 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Additional Feature | DEVICE IS ALSO AVAILABLE IN A 80 PIN SQUARE QFP14 PACKAGE; OPERATES WITH A -1.8V TO -3.6V SUPPLY | |
Address Bus Width | ||
Bit Size | 4 | |
Clock Frequency-Max | 0.032 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-XUUC-N79 | |
Number of I/O Lines | 21 | |
Number of Terminals | 79 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | NO | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
ROM Programmability | MROM | |
Speed | 0.032 MHz | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |