Part Details for S25FL128SAGBHI300 by Cypress Semiconductor
Overview of S25FL128SAGBHI300 by Cypress Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Healthcare
Price & Stock for S25FL128SAGBHI300
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
40AH1245
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Newark | Flash Memory, 128Mbit, -40 To 85Deg C Rohs Compliant: Yes |Cypress Infineon Technologies S25FL128SAGBHI300 Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$3.5200 / $4.4500 | Buy Now |
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Rochester Electronics | S25FL128S - (16-MB), 3.0 V FL-L Flash Memory RoHS: Compliant Status: Active Min Qty: 1 | 260 |
|
$2.6500 / $3.1100 | Buy Now |
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DISTI #
3259908
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element14 Asia-Pacific | FLASH MEMORY, 128MBIT, -40 TO 85DEG C RoHS: Compliant Min Qty: 1 Container: Each | 0 |
|
$3.4237 / $4.6956 | Buy Now |
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|
Flip Electronics | Stock, ship today | 1813 |
|
$2.3300 | RFQ |
Part Details for S25FL128SAGBHI300
S25FL128SAGBHI300 CAD Models
S25FL128SAGBHI300 Part Data Attributes:
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S25FL128SAGBHI300
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
S25FL128SAGBHI300
Cypress Semiconductor
Flash, 32MX4, PBGA24, FBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | ALSO CONFIGURABLE AS 128M X 1 | |
| Alternate Memory Width | 2 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,4X6,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Cycle Time-Max (tWC) | 500 ms | |
| Write Protection | HARDWARE/SOFTWARE |