Part Details for S25FL256SAGBHEA03 by Infineon Technologies AG
Overview of S25FL256SAGBHEA03 by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S25FL256SAGBHEA03
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AC0618
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Newark | Nor/Reel Rohs Compliant: Yes |Infineon S25FL256SAGBHEA03 Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
Buy Now | |
DISTI #
448-S25FL256SAGBHEA03TR-ND
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DigiKey | IC FLASH 256MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 8 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$38.9211 | Buy Now |
DISTI #
727-25FL256SAGBHEA03
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Mouser Electronics | NOR Flash A&D RoHS: Compliant | 0 |
|
$37.7900 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks Container: Reel | 0Reel |
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$37.7900 | Buy Now |
DISTI #
SP005652043
|
EBV Elektronik | NOR Flash 256Mbit 64M X 4Bit/128M X 2Bit/256M X 1Bit Serial-SPI 24-Pin BGA T/R (Alt: SP005652043) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 9 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for S25FL256SAGBHEA03
S25FL256SAGBHEA03 CAD Models
S25FL256SAGBHEA03 Part Data Attributes
|
S25FL256SAGBHEA03
Infineon Technologies AG
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Datasheet
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S25FL256SAGBHEA03
Infineon Technologies AG
Flash, 32MX8, PBGA24, BGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | BGA-24 | |
Reach Compliance Code | compliant | |
Alternate Memory Width | 4 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,5X5,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.0003 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |