Datasheets
S25FL256SAGBHEA03 by:

Flash, 32MX8, PBGA24, BGA-24

Part Details for S25FL256SAGBHEA03 by Infineon Technologies AG

Overview of S25FL256SAGBHEA03 by Infineon Technologies AG

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Price & Stock for S25FL256SAGBHEA03

Part # Distributor Description Stock Price Buy
DISTI # 85AC0618
Newark Nor/Reel Rohs Compliant: Yes |Infineon S25FL256SAGBHEA03 Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel 0
Buy Now
DISTI # 448-S25FL256SAGBHEA03TR-ND
DigiKey IC FLASH 256MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 8 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,500 $38.9211
$38.9211 Buy Now
DISTI # 727-25FL256SAGBHEA03
Mouser Electronics NOR Flash A&D RoHS: Compliant 0
  • 2,500 $37.7900
$37.7900 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks Container: Reel 0
Reel
  • 2,500 $37.7900
$37.7900 Buy Now
DISTI # SP005652043
EBV Elektronik NOR Flash 256Mbit 64M X 4Bit/128M X 2Bit/256M X 1Bit Serial-SPI 24-Pin BGA T/R (Alt: SP005652043) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 9 Weeks, 0 Days EBV - 0
Buy Now

Part Details for S25FL256SAGBHEA03

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S25FL256SAGBHEA03 Part Data Attributes

S25FL256SAGBHEA03 Infineon Technologies AG
Buy Now Datasheet
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S25FL256SAGBHEA03 Infineon Technologies AG Flash, 32MX8, PBGA24, BGA-24
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description BGA-24
Reach Compliance Code compliant
Alternate Memory Width 4
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 20
Endurance 100 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
JESD-609 Code e1
Length 8 mm
Memory Density 268435456 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 24
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.0003 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

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