Part Details for S25FL256SAGBHI200 by Spansion
Overview of S25FL256SAGBHI200 by Spansion
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Part Details for S25FL256SAGBHI200
S25FL256SAGBHI200 CAD Models
S25FL256SAGBHI200 Part Data Attributes
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S25FL256SAGBHI200
Spansion
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Datasheet
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S25FL256SAGBHI200
Spansion
Flash, 64MX4, PBGA24, FBGA-24
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | BGA | |
Package Description | FBGA-24 | |
Pin Count | 24 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Spansion | |
Additional Feature | ALSO CONFIGURABLE AS 128M X 1 | |
Alternate Memory Width | 2 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,5X5,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Cycle Time-Max (tWC) | 500 ms | |
Write Protection | HARDWARE/SOFTWARE |