Part Details for S25FL512SAGBHMC13 by Infineon Technologies AG
Overview of S25FL512SAGBHMC13 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S25FL512SAGBHMC13
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S25FL512SAGBHMC13TR-ND
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DigiKey | IC FLASH 512MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 8 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$9.7998 | Buy Now |
|
DISTI #
727-S5FL512SAGBHMC13
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Mouser Electronics | NOR Flash STD SPI RoHS: Compliant | 0 |
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$9.5200 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks Container: Reel | 0Reel |
|
$8.7100 | Buy Now |
|
DISTI #
SP005658613
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EBV Elektronik | NOR Flash 512Mbit 128M X 4Bit/256M X 2Bit/512M X 1Bit Serial-SPI 24-Pin BGA T/R (Alt: SP005658613) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for S25FL512SAGBHMC13
S25FL512SAGBHMC13 CAD Models
S25FL512SAGBHMC13 Part Data Attributes
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S25FL512SAGBHMC13
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S25FL512SAGBHMC13
Infineon Technologies AG
Flash, 64MX8, PBGA24, BGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-24 | |
| Reach Compliance Code | compliant | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 512753664 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 64094208 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.0003 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |