There are no models available for this part yet.
Overview of S25HS02GTDPBHB050 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S25HS02GTDPBHB050 by Cypress Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
88AH5716
|
Newark | Nor/Tray |Cypress Infineon Technologies S25HS02GTDPBHB050 RoHS: Not Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | ||
Rochester Electronics | S25HS02GT - SEMPER NOR Flash Memory RoHS: Compliant Status: Active Min Qty: 1 | 83 |
|
$26.4400 / $31.1100 | Buy Now |
CAD Models for S25HS02GTDPBHB050 by Cypress Semiconductor
Part Data Attributes for S25HS02GTDPBHB050 by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Reach Compliance Code
|
compliant
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
Data Retention Time-Min
|
25
|
Endurance
|
2560000 Write/Erase Cycles
|
JESD-30 Code
|
S-PBGA-B24
|
Length
|
8 mm
|
Memory Density
|
2147483648 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
24
|
Number of Words
|
268435456 words
|
Number of Words Code
|
256000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
105 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
256MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TBGA
|
Package Equivalence Code
|
BGA24,5X5,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial
|
SERIAL
|
Programming Voltage
|
1.8 V
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
1.2 mm
|
Serial Bus Type
|
QSPI
|
Supply Voltage-Max (Vsup)
|
2 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Type
|
NOR TYPE
|
Width
|
8 mm
|
Write Protection
|
HARDWARE
|