Datasheets
S25HS02GTDZBHM053 by:

Flash, 256MX8, PBGA24, BGA-24

Part Details for S25HS02GTDZBHM053 by Infineon Technologies AG

Overview of S25HS02GTDZBHM053 by Infineon Technologies AG

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for S25HS02GTDZBHM053

Part # Distributor Description Stock Price Buy
DISTI # 448-S25HS02GTDZBHM053TR-ND
DigiKey IC FLASH 2GBIT SPI/QUAD 24BGA Min Qty: 2000 Lead time: 8 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,000 $29.8314
$29.8314 Buy Now
DISTI # S25HS02GTDZBHM053
Avnet Americas NOR Flash 2Gbit 256M X 8bit SPI 3V 9ns 24-Pin BGA T/R - Tape and Reel (Alt: S25HS02GTDZBHM053) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days Container: Reel 0
  • 2,000 $35.9135
$35.9135 Buy Now
DISTI # 727-25H02GTDZBHM053
Mouser Electronics NOR Flash SEMPER RoHS: Compliant 0
  • 2,000 $28.9700
$28.9700 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks Container: Reel 0
Reel
  • 2,000 $28.9700
$28.9700 Buy Now

Part Details for S25HS02GTDZBHM053

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S25HS02GTDZBHM053 Part Data Attributes

S25HS02GTDZBHM053 Infineon Technologies AG
Buy Now Datasheet
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S25HS02GTDZBHM053 Infineon Technologies AG Flash, 256MX8, PBGA24, BGA-24
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description BGA-24
Reach Compliance Code compliant
Factory Lead Time 8 Weeks
Clock Frequency-Max (fCLK) 166 MHz
Data Retention Time-Min 25
Endurance 300000 Write/Erase Cycles
JESD-30 Code S-PBGA-B24
Length 8 mm
Memory Density 2147483648 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 24
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 256MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.001 A
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 8 mm
Write Protection HARDWARE

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