Datasheets
S26HL02GTFGBHM043 by:

Flash, 2GX1, PBGA24, BGA-24

Part Details for S26HL02GTFGBHM043 by Infineon Technologies AG

Overview of S26HL02GTFGBHM043 by Infineon Technologies AG

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Applications Space Technology Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Price & Stock for S26HL02GTFGBHM043

Part # Distributor Description Stock Price Buy
DISTI # 448-S26HL02GTFGBHM043TR-ND
DigiKey IC FLASH 2GBIT HYPERBUS 24FBGA Min Qty: 2000 Lead time: 8 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,000 $36.4620
$36.4620 Buy Now
DISTI # S26HL02GTFGBHM043
Avnet Americas NOR Flash 2Gbit 256M X 8 SPI 3V 24-Pin BGA T/R - Tape and Reel (Alt: S26HL02GTFGBHM043) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days Container: Reel 0
  • 2,000 $43.8960
$43.8960 Buy Now
DISTI # 727-26HL02GTFGBHM043
Mouser Electronics NOR Flash SEMPER RoHS: Compliant 0
  • 2,000 $35.4000
$35.4000 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Container: Reel 0
Reel
  • 2,000 $35.4000
$35.4000 Buy Now
DISTI # S26HL02GTFGBHM043
Avnet Americas NOR Flash 2Gbit 256M X 8 SPI 3V 24-Pin BGA T/R - Tape and Reel (Alt: S26HL02GTFGBHM043) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days Container: Reel 0
  • 2,000 $43.8960
$43.8960 Buy Now
DISTI # SP005726570
EBV Elektronik (Alt: SP005726570) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 1 Weeks, 2 Days EBV - 0
Buy Now

Part Details for S26HL02GTFGBHM043

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S26HL02GTFGBHM043 Part Data Attributes:

S26HL02GTFGBHM043 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
S26HL02GTFGBHM043 Infineon Technologies AG Flash, 2GX1, PBGA24, BGA-24
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description BGA-24
Reach Compliance Code compliant
Factory Lead Time 8 Weeks
Clock Frequency-Max (fCLK) 133 MHz
JESD-30 Code S-PBGA-B24
Memory Density 2147483648 bit
Memory IC Type FLASH
Memory Width 1
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 24
Number of Words 2147483648 words
Number of Words Code 2000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 2GX1
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Screening Level AEC-Q100
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE

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