Part Details for S26HS02GTFPBHB040 by Infineon Technologies AG
Overview of S26HS02GTFPBHB040 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S26HS02GTFPBHB040
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S26HS02GTFPBHB040-ND
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DigiKey | IC FLASH 2GBIT HYPERBUS 24FBGA Min Qty: 520 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$36.6117 | Buy Now |
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DISTI #
S26HS02GTFPBHB040
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Avnet Americas | NOR Flash 2Gbit 256M X 8 SPI 1.8V 24-Pin BGA Tray - Trays (Alt: S26HS02GTFPBHB040) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$38.4474 | Buy Now |
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DISTI #
727-26HS02GTFPBHB040
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Mouser Electronics | NOR Flash Y RoHS: Compliant | 0 |
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$35.8000 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 520 Package Multiple: 520 Lead time: 8 Weeks | 0 |
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$34.5800 | Buy Now |
Part Details for S26HS02GTFPBHB040
S26HS02GTFPBHB040 CAD Models
S26HS02GTFPBHB040 Part Data Attributes
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S26HS02GTFPBHB040
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S26HS02GTFPBHB040
Infineon Technologies AG
Flash, 2GX1, PBGA24, BGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-24 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| JESD-30 Code | S-PBGA-B24 | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2147483648 words | |
| Number of Words Code | 2000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2GX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 1.8 V | |
| Screening Level | AEC-Q100 | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE |