There are no models available for this part yet.
Overview of S26HS02GTFPBHM050 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for S26HS02GTFPBHM050 by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
448-S26HS02GTFPBHM050-ND
|
DigiKey | IC FLASH 2GBIT HYPERBUS 24FBGA Min Qty: 520 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$38.8248 | Buy Now | |
|
DISTI #
S26HS02GTFPBHM050
|
Avnet Americas | NOR Flash 2Gbit 256M X 8 SPI 1.8V 24-Pin BGA Tray - Trays (Alt: S26HS02GTFPBHM050) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$40.9355 | Buy Now | |
|
DISTI #
727-26HS02GTFPBHM050
|
Mouser Electronics | NOR Flash Y RoHS: Compliant | 0 |
|
$37.8700 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 520 Package Multiple: 520 Lead time: 8 Weeks | 0 |
|
$36.8200 | Buy Now |
CAD Models for S26HS02GTFPBHM050 by Infineon Technologies AG
Part Data Attributes for S26HS02GTFPBHM050 by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Package Description
|
BGA-24
|
|
Reach Compliance Code
|
compliant
|
|
Factory Lead Time
|
8 Weeks
|
|
Clock Frequency-Max (fCLK)
|
166 MHz
|
|
JESD-30 Code
|
S-PBGA-B24
|
|
Memory Density
|
2147483648 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
1
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
2147483648 words
|
|
Number of Words Code
|
2000000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
2GX1
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Shape
|
SQUARE
|
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Package Style
|
GRID ARRAY
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Programming Voltage
|
1.8 V
|
|
Screening Level
|
AEC-Q100
|
|
Supply Voltage-Max (Vsup)
|
2 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Form
|
BALL
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Type
|
NOR TYPE
|