Part Details for S26KL128SDABHB030 by Infineon Technologies AG
Overview of S26KL128SDABHB030 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S26KL128SDABHB030
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
S26KL128SDABHB030-ND
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DigiKey | IC FLASH 128MBIT PAR 24FBGA Min Qty: 338 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$6.6448 | Buy Now |
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DISTI #
727-S26KL128SDABHB03
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Mouser Electronics | NOR Flash NOR RoHS: Compliant | 0 |
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$5.9500 / $6.0600 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 338 Package Multiple: 338 Lead time: 8 Weeks Container: Tray | 0Tray |
|
$4.8400 | Buy Now |
Part Details for S26KL128SDABHB030
S26KL128SDABHB030 CAD Models
S26KL128SDABHB030 Part Data Attributes
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S26KL128SDABHB030
Infineon Technologies AG
Buy Now
Datasheet
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S26KL128SDABHB030
Infineon Technologies AG
Flash, 16MX8, 96ns, PBGA24,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Serial Bus Type | HYPERBUS | |
| Standby Current-Max | 0.000004 A | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE |