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Overview of S29GL01GS11DHAV20 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for S29GL01GS11DHAV20 by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
448-S29GL01GS11DHAV20-ND
|
DigiKey | IC FLASH 1GBIT PARALLEL 64FBGA Min Qty: 2600 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$12.1059 | Buy Now | |
|
DISTI #
727-S29GL01GS11DHAV2
|
Mouser Electronics | NOR Flash IC 1 Gb FLASH MEMORY RoHS: Compliant | 0 |
|
$11.9400 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: No Min Qty: 2600 Package Multiple: 2600 Lead time: 8 Weeks | 0 |
|
$11.6000 | Buy Now |
CAD Models for S29GL01GS11DHAV20 by Infineon Technologies AG
Part Data Attributes for S29GL01GS11DHAV20 by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Reach Compliance Code
|
compliant
|
|
Samacsys Manufacturer
|
Infineon
|
|
Access Time-Max
|
110 ns
|
|
Command User Interface
|
YES
|
|
Common Flash Interface
|
YES
|
|
Data Polling
|
YES
|
|
Data Retention Time-Min
|
20
|
|
Endurance
|
100000 Write/Erase Cycles
|
|
JESD-30 Code
|
S-PBGA-B64
|
|
JESD-609 Code
|
e1
|
|
Length
|
9 mm
|
|
Memory Density
|
1073741824 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
16
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Sectors/Size
|
1024
|
|
Number of Terminals
|
64
|
|
Number of Words
|
67108864 words
|
|
Number of Words Code
|
64000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
64MX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA64,8X8,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Page Size
|
16 words
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Programming Voltage
|
3 V
|
|
Ready/Busy
|
YES
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1.4 mm
|
|
Sector Size
|
64K
|
|
Standby Current-Max
|
0.0001 A
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Toggle Bit
|
YES
|
|
Type
|
NOR TYPE
|
|
Width
|
9 mm
|
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