There are no models available for this part yet.
Overview of S29GL01GS11TFA010 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for S29GL01GS11TFA010 by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
448-S29GL01GS11TFA010-ND
|
DigiKey | IC FLASH 1GBIT PARALLEL 56TSOP Min Qty: 910 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$12.7906 | Buy Now | |
DISTI #
727-S29GL01GS11TFA01
|
Mouser Electronics | NOR Flash Y RoHS: Compliant | 0 |
|
$12.2400 | Order Now | |
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 910 Package Multiple: 910 Lead time: 8 Weeks | 0 |
|
$11.6000 | Buy Now |
CAD Models for S29GL01GS11TFA010 by Infineon Technologies AG
Part Data Attributes for S29GL01GS11TFA010 by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code
|
compliant
|
Access Time-Max
|
110 ns
|
Command User Interface
|
YES
|
Common Flash Interface
|
YES
|
Data Polling
|
YES
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PDSO-G56
|
JESD-609 Code
|
e3
|
Length
|
18.4 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
16
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Sectors/Size
|
1024
|
Number of Terminals
|
56
|
Number of Words
|
67108864 words
|
Number of Words Code
|
64000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
64MX16
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSSOP
|
Package Equivalence Code
|
TSSOP56,.78,20
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Page Size
|
16 words
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Programming Voltage
|
3 V
|
Ready/Busy
|
YES
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
1.2 mm
|
Sector Size
|
64K
|
Standby Current-Max
|
0.0001 A
|
Supply Current-Max
|
0.1 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Matte Tin (Sn)
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Toggle Bit
|
YES
|
Type
|
NOR TYPE
|
Width
|
14 mm
|