There are no models available for this part yet.
Overview of S29GL256S10DHI010 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for S29GL256S10DHI010 by Cypress Semiconductor
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
63T2580
|
Newark | Flash Memory, 256 Mbit, 100 Ns, 64-Bga, Flash Memory Type:Parallel Nor, Memory Size:256Mbit, Flash Memory Configuration:16M X 16Bit, Ic Interface Type:Parallel, Memory Case Style:Fbga, No. Of Pins:64Pins, Clock Frequency:- Rohs Compliant: Yes |Cypress Infineon Technologies S29GL256S10DHI010 RoHS: Compliant Min Qty: 520 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | ||
|
DISTI #
2832-S29GL256S10DHI010-ND
|
DigiKey | IC FLASH 256MBIT PARALLEL 64FBGA Min Qty: 54 Container: Tray MARKETPLACE PRODUCT |
1428 In Stock |
|
$14.5100 | Buy Now | |
| Flip Electronics | Stock, ship today | 30264 |
|
RFQ | |||
| New Advantage Corporation | GL-S Series 256 Mb (16 M x 16) 3.6 V Flash Memory - Fortified BGA-64 RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 260 |
|
$6.9500 | Buy Now |
CAD Models for S29GL256S10DHI010 by Cypress Semiconductor
Part Data Attributes for S29GL256S10DHI010 by Cypress Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
|
Package Description
|
9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.1.A
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
100 ns
|
|
Boot Block
|
BOTTOM/TOP
|
|
Command User Interface
|
YES
|
|
Common Flash Interface
|
YES
|
|
Data Polling
|
YES
|
|
JESD-30 Code
|
S-PBGA-B64
|
|
JESD-609 Code
|
e1
|
|
Length
|
9 mm
|
|
Memory Density
|
268435456 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
16
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Sectors/Size
|
256
|
|
Number of Terminals
|
64
|
|
Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
16MX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA64,8X8,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Page Size
|
16 words
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Programming Voltage
|
2.7 V
|
|
Qualification Status
|
Not Qualified
|
|
Ready/Busy
|
YES
|
|
Seated Height-Max
|
1.4 mm
|
|
Sector Size
|
64K
|
|
Standby Current-Max
|
0.0001 A
|
|
Supply Current-Max
|
0.08 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Toggle Bit
|
YES
|
|
Type
|
NOR TYPE
|
|
Width
|
9 mm
|
Alternate Parts for S29GL256S10DHI010
This table gives cross-reference parts and alternative options found for S29GL256S10DHI010. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL256S10DHI010, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S29GL256S10FHIV23 | Flash, 16MX16, 100ns, PBGA64, FBGA-64 | Cypress Semiconductor | S29GL256S10DHI010 vs S29GL256S10FHIV23 |
| S29GL256S10FHI010 | Flash, 32MX8, 100ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64 | Cypress Semiconductor | S29GL256S10DHI010 vs S29GL256S10FHI010 |
| S29GL256S10DHI020 | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | Spansion | S29GL256S10DHI010 vs S29GL256S10DHI020 |
| S29GL256S10FHI020 | EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64 | Infineon Technologies AG | S29GL256S10DHI010 vs S29GL256S10FHI020 |
| S29GL256S10DHIV23 | Flash, 32MX8, 100ns, PBGA64, PACKAGE | Cypress Semiconductor | S29GL256S10DHI010 vs S29GL256S10DHIV23 |
| S29GL256S10FAIV13 | Flash, | Cypress Semiconductor | S29GL256S10DHI010 vs S29GL256S10FAIV13 |
| S29GL256S10FHIV20 | EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64 | Spansion | S29GL256S10DHI010 vs S29GL256S10FHIV20 |
| S29GL256S10DHI013 | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | Spansion | S29GL256S10DHI010 vs S29GL256S10DHI013 |
| S29GL256S10FAIV13 | Flash, 32MX8, 100ns, PBGA64, | Infineon Technologies AG | S29GL256S10DHI010 vs S29GL256S10FAIV13 |
| S29GL256S10FHI010 | Flash, 32MX8, 100ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64 | Spansion | S29GL256S10DHI010 vs S29GL256S10FHI010 |
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