Part Details for S29GL512S10TFA010 by Infineon Technologies AG
Overview of S29GL512S10TFA010 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL512S10TFA010
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S29GL512S10TFA010-ND
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DigiKey | IC FLASH 512MBIT PARALLEL 56TSOP Min Qty: 182 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$9.1970 | Buy Now |
DISTI #
S29GL512S10TFA010
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Avnet Americas | NOR Flash Parallel 3V 512Mbit 32M x 16bit 100ns 56-Pin TSOP Tray - Trays (Alt: S29GL512S10TFA010) RoHS: Compliant Min Qty: 182 Package Multiple: 91 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$9.3155 | Buy Now |
DISTI #
727-S29GL512S10TFA01
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Mouser Electronics | NOR Flash Nor RoHS: Compliant | 0 |
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$8.6300 / $8.6800 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 182 Package Multiple: 182 Lead time: 8 Weeks Container: Tray | 0Tray |
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$7.5200 | Buy Now |
Part Details for S29GL512S10TFA010
S29GL512S10TFA010 CAD Models
S29GL512S10TFA010 Part Data Attributes
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S29GL512S10TFA010
Infineon Technologies AG
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Datasheet
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S29GL512S10TFA010
Infineon Technologies AG
Flash, 64MX8, 100ns, PDSO56,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 100 ns | |
Additional Feature | 20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES | |
Alternate Memory Width | 1 | |
Boot Block | BOTTOM/TOP | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
Data Retention Time-Min | 2 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G56 | |
JESD-609 Code | e3 | |
Length | 18.4 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Sectors/Size | 512 | |
Number of Terminals | 56 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP56,.8,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Page Size | 32 words | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3 V | |
Ready/Busy | YES | |
Screening Level | AEC-Q100; TS 16949 | |
Seated Height-Max | 1.2 mm | |
Sector Size | 128K | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Toggle Bit | YES | |
Type | NAND TYPE | |
Width | 14 mm |