There are no models available for this part yet.
Overview of S29PL064J60BFA070 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for S29PL064J60BFA070 by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
448-S29PL064J60BFA070-ND
|
DigiKey | IC FLASH 64MBIT CFI 48FBGA Min Qty: 1690 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$5.6484 | Buy Now | |
DISTI #
727-S29PL064J60BFA70
|
Mouser Electronics | NOR Flash Y RoHS: Compliant | 0 |
|
Order Now | ||
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1690 Package Multiple: 1690 Lead time: 8 Weeks | 0 |
|
$5.0200 | Buy Now |
CAD Models for S29PL064J60BFA070 by Infineon Technologies AG
Part Data Attributes for S29PL064J60BFA070 by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Not Recommended
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Package Description
|
FBGA-48
|
Reach Compliance Code
|
compliant
|
Access Time-Max
|
60 ns
|
Additional Feature
|
TOP AND BOTTOM BOOT BLOCK
|
Boot Block
|
BOTTOM/TOP
|
Command User Interface
|
YES
|
Common Flash Interface
|
YES
|
Data Polling
|
YES
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PBGA-B48
|
Length
|
8.15 mm
|
Memory Density
|
67108864 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
16
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Sectors/Size
|
16,126
|
Number of Terminals
|
48
|
Number of Words
|
4194304 words
|
Number of Words Code
|
4000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
4MX16
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
VFBGA
|
Package Equivalence Code
|
BGA48,6X8,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size
|
8 words
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Programming Voltage
|
3 V
|
Ready/Busy
|
YES
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
1 mm
|
Sector Size
|
4K,32K
|
Standby Current-Max
|
0.000005 A
|
Supply Current-Max
|
0.07 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Toggle Bit
|
YES
|
Type
|
NOR TYPE
|
Width
|
6.15 mm
|
Write Cycle Time-Max (tWC)
|
0.00006 ms
|