Part Details for S29PL064J70BFW070 by Infineon Technologies AG
Overview of S29PL064J70BFW070 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for S29PL064J70BFW070
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S29PL064J70BFW070-ND
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DigiKey | IC FLASH 64MBIT PARALLEL 48VFBGA Min Qty: 1690 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$5.6484 | Buy Now |
DISTI #
727-29PL064J70BFW070
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Mouser Electronics | NOR Flash Y RoHS: Compliant | 0 |
|
Order Now | |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1690 Package Multiple: 1690 Lead time: 8 Weeks | 0 |
|
$5.0200 | Buy Now |
Part Details for S29PL064J70BFW070
S29PL064J70BFW070 CAD Models
S29PL064J70BFW070 Part Data Attributes
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S29PL064J70BFW070
Infineon Technologies AG
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Datasheet
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Compare Parts:
S29PL064J70BFW070
Infineon Technologies AG
Flash, 4MX16, 70ns, PBGA48, FBGA-48
|
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-48 | |
Reach Compliance Code | compliant | |
Access Time-Max | 70 ns | |
Additional Feature | TOP AND BOTTOM BOOT BLOCK | |
Boot Block | BOTTOM/TOP | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B48 | |
Length | 8.15 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Sectors/Size | 16,126 | |
Number of Terminals | 48 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 4MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA48,6X8,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Page Size | 8 words | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3 V | |
Ready/Busy | YES | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1 mm | |
Sector Size | 4K,32K | |
Standby Current-Max | 0.000005 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Toggle Bit | YES | |
Type | NOR TYPE | |
Width | 6.15 mm | |
Write Cycle Time-Max (tWC) | 0.00007 ms |