Part Details for S34ML01G200BHI000 by Spansion
Overview of S34ML01G200BHI000 by Spansion
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Price & Stock for S34ML01G200BHI000
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-S34ML01G200BHI000-ND
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DigiKey | FLASH, 128MX8, 25NS, PBGA63 Min Qty: 107 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
1208 In Stock |
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$2.8200 | Buy Now |
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Bristol Electronics | 10 |
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RFQ | ||
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Quest Components | FLASH, 128MX8, 25NS, PBGA63 | 7982 |
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$1.9058 / $5.4450 | Buy Now |
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Quest Components | FLASH, 128MX8, 25NS, PBGA63 | 8 |
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$1.9600 / $2.4500 | Buy Now |
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Quest Components | FLASH, 128MX8, 25NS, PBGA63 | 1 |
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$3.7800 | Buy Now |
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Rochester Electronics | Flash, 128MX8, 25ns, PBGA63 RoHS: Compliant Status: Active Min Qty: 1 | 1208 |
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$2.4200 / $2.8400 | Buy Now |
Part Details for S34ML01G200BHI000
S34ML01G200BHI000 CAD Models
S34ML01G200BHI000 Part Data Attributes
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S34ML01G200BHI000
Spansion
Buy Now
Datasheet
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Compare Parts:
S34ML01G200BHI000
Spansion
Flash, 128MX8, 25ns, PBGA63, BGA-63
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SPANSION INC | |
Package Description | BGA-63 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Spansion | |
Access Time-Max | 25 ns | |
Command User Interface | YES | |
Common Flash Interface | NO | |
Data Polling | NO | |
Data Retention Time-Min | 10 | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Sectors/Size | 1K | |
Number of Terminals | 63 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA63,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Page Size | 2K words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 3.3 V | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Seated Height-Max | 1 mm | |
Sector Size | 128K | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Toggle Bit | NO | |
Type | SLC NAND TYPE | |
Width | 9 mm | |
Write Cycle Time-Max (tWC) | 0.000025 ms |