Part Details for S34ML04G100BHV000 by Cypress Semiconductor
Overview of S34ML04G100BHV000 by Cypress Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S34ML04G100BHV000
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | Flash, 512MX8, PBGA63 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 5 |
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$4.4700 / $5.2600 | Buy Now |
Part Details for S34ML04G100BHV000
S34ML04G100BHV000 CAD Models
S34ML04G100BHV000 Part Data Attributes
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S34ML04G100BHV000
Cypress Semiconductor
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Datasheet
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S34ML04G100BHV000
Cypress Semiconductor
Flash, 512MX8, PBGA63, BGA-63
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Package Description | BGA-63 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Command User Interface | YES | |
Common Flash Interface | NO | |
Data Polling | NO | |
Data Retention Time-Min | 10 | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA64,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 1 mm | |
Standby Current-Max | 0.00001 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Type | SLC NAND TYPE | |
Width | 9 mm |