S70KL1282GABHB033
Description: 16MX8, 35ns, CMOS, PBGA24, FBGA-24

Overview of S70KL1282GABHB033 by Infineon Technologies AG

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 4 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )

Price & Stock for S70KL1282GABHB033 by Infineon Technologies AG

Part # Manufacturer Description Stock Price Buy
DISTI # 448-S70KL1282GABHB033TR-ND
DigiKey IC PSRAM 128MBIT HYPERBUS 24FBGA Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,500 $3.9640
$3.9640 Buy Now
DISTI # 727-S70KL1282GABHB33
Mouser Electronics DRAM U RoHS: Compliant 0
  • 2,500 $3.9200
$3.9200 Order Now
Future Electronics   RoHS: Compliant pbFree: No Min Qty: 2500 Package Multiple: 2500 Lead time: 10 Weeks 0
  • 2,500 $3.5200
$3.5200 Buy Now
DISTI # SP005671133
EBV Elektronik (Alt: SP005671133) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 11 Weeks, 0 Days EBV - 0
Buy Now

CAD Models for S70KL1282GABHB033 by Infineon Technologies AG
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Part Data Attributes for S70KL1282GABHB033 by Infineon Technologies AG

S70KL1282GABHB033
Infineon Technologies AG
-
-
Rohs Code
Yes
Part Life Cycle Code
Active
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
Package Description
FBGA-24
Reach Compliance Code
compliant
Access Time-Max
35 ns
Additional Feature
SELF REFRESH
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B24
Length
8 mm
Memory Density
134217728 bit
Memory IC Type
HYPERRAM
Memory Width
8
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
1
Number of Terminals
24
Number of Words
16777216 words
Number of Words Code
16000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Organization
16MX8
Package Body Material
PLASTIC/EPOXY
Package Code
VBGA
Package Equivalence Code
BGA24,5X5,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Self Refresh
YES
Standby Current-Max
0.0005 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6 mm
Want to compare parts?
  1. S70KL1282GABHB033
    Infineon Technologies AG
    16MX8, 35ns, CMOS, PBGA24, FBGA-24
    VS

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