Part Details for S70KL1282GABHV023 by Infineon Technologies AG
Overview of S70KL1282GABHV023 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S70KL1282GABHV023
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S70KL1282GABHV023TR-ND
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DigiKey | IC PSRAM 128MBIT HYPERBUS 24FBGA Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$4.0452 | Buy Now |
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DISTI #
727-S70KL1282GABHV02
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Mouser Electronics | DRAM HyperRAM RoHS: Compliant | 0 |
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$3.9200 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 2500 Package Multiple: 2500 Lead time: 10 Weeks Container: Reel | 0Reel |
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$3.5200 | Buy Now |
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DISTI #
SP005671141
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EBV Elektronik | DRAM Chip SDRAM 128Mb 16M X 8Bit 3V 24-Pin FBGA T/R (Alt: SP005671141) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 11 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for S70KL1282GABHV023
S70KL1282GABHV023 CAD Models
S70KL1282GABHV023 Part Data Attributes
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S70KL1282GABHV023
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S70KL1282GABHV023
Infineon Technologies AG
16MX8, CMOS, PBGA24,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | HYPERRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Standby Current-Max | 0.00075 A | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |