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Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SDINBDG4-16G-I1 by SanDisk Corporation is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
SDINBDG4-16G-I1
|
Avnet Americas | Flash Memory Card 16GB 2.7V to 3.6V Embedded Flash Drive BGA - Trays (Alt: SDINBDG4-16G-I1) RoHS: Not Compliant Min Qty: 152 Package Multiple: 1 Lead time: 10 Weeks, 0 Days Container: Tray | 134 |
|
$9.2784 / $9.6246 | Buy Now |
DISTI #
SDINBDG4-16G-I1
|
Avnet Americas | Flash Memory Card 16GB 2.7V to 3.6V Embedded Flash Drive BGA - Trays (Alt: SDINBDG4-16G-I1) RoHS: Not Compliant Min Qty: 152 Package Multiple: 1 Lead time: 10 Weeks, 0 Days Container: Tray | 134 |
|
$9.2784 / $9.6246 | Buy Now |
DISTI #
SDINBDG4-16G-I1
|
Avnet Silica | Flash Memory Card 16GB 27V to 36V Embedded Flash Drive BGA (Alt: SDINBDG4-16G-I1) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 9 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
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SDINBDG4-16G-I1
SanDisk Corporation
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SDINBDG4-16G-I1
SanDisk Corporation
Flash,
|
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SANDISK CORP | |
Package Description | VFBGA-153 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Factory Lead Time | 10 Weeks | |
Samacsys Manufacturer | SanDisk | |
Clock Frequency-Max (fCLK) | 200 MHz | |
Endurance | 3000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B153 | |
Length | 13 mm | |
Memory Density | 137438953472 bit | |
Memory IC Type | Embedded MMC | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 17179869184 words | |
Number of Words Code | 16000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 16GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA153,14X14,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 0.8 mm | |
Serial Bus Type | EMMC 5.1 | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Type | MLC NAND TYPE | |
Width | 11.5 mm |
The recommended operating temperature range for the SDINBDG4-16G-I1 is -25°C to 85°C, with optimal performance between 0°C to 70°C.
To ensure data integrity, use a voltage regulator to maintain a stable power supply, and consider implementing a power-fail interrupt to safely shut down the system during power failures.
The SDINBDG4-16G-I1 supports up to 3,000 write cycles per block, with a total of 16GB divided into 4,096 blocks.
Yes, the SDINBDG4-16G-I1 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments.
The SDINBDG4-16G-I1 supports the Secure Erase and Sanitize commands as per the SD specification. Consult the SD specification and the device's datasheet for implementation details.