Datasheets
SDINBDG4-16G-ZA by:

Flash, 16X8, PACKAGE

Part Details for SDINBDG4-16G-ZA by Western Digital Corp

Overview of SDINBDG4-16G-ZA by Western Digital Corp

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Price & Stock for SDINBDG4-16G-ZA

Part # Distributor Description Stock Price Buy
DISTI # SDINBDG4-16G-ZA
Avnet Americas Flash Memory Card, Embedded MultiMedia Card (eMMC) 5.1, 16 GB - Trays (Alt: SDINBDG4-16G-ZA) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 26 Weeks, 0 Days Container: Tray 0
  • 152 $24.0120
$24.0120 Buy Now
Quest Components   52
  • 1 $30.3000
  • 18 $27.2700
  • 38 $25.7550
$25.7550 / $30.3000 Buy Now
DISTI # SDINBDG4-16G-ZA
Avnet Americas Flash Memory Card, Embedded MultiMedia Card (eMMC) 5.1, 16 GB - Trays (Alt: SDINBDG4-16G-ZA) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 26 Weeks, 0 Days Container: Tray 0
  • 152 $24.0120
$24.0120 Buy Now
DISTI # SDINBDG4-16G-ZA
Avnet Americas Flash Memory Card, Embedded MultiMedia Card (eMMC) 5.1, 16 GB - Trays (Alt: SDINBDG4-16G-ZA) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 26 Weeks, 0 Days Container: Tray 0
  • 152 $24.0120
$24.0120 Buy Now
DISTI # SDINBDG4-16G-ZA
Avnet Silica Flash Memory Card, Embedded MultiMedia Card (eMMC) 5.1, 16 GB (Alt: SDINBDG4-16G-ZA) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 1 Weeks, 2 Days Silica - 0
Buy Now

Part Details for SDINBDG4-16G-ZA

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SDINBDG4-16G-ZA Part Data Attributes

SDINBDG4-16G-ZA Western Digital Corp
Buy Now Datasheet
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SDINBDG4-16G-ZA Western Digital Corp Flash, 16X8, PACKAGE
Part Life Cycle Code Active
Ihs Manufacturer WESTERN DIGITAL CORP
Package Description ,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Factory Lead Time 26 Weeks
Data Retention Time-Min 15
JESD-30 Code R-PBGA-B153
Length 13 mm
Memory Density 137438953472 bit
Memory IC Type FLASH CARD
Memory Width 8
Number of Functions 1
Number of Terminals 153
Number of Words 17179869184 words
Number of Words Code 16000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 16GX8
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA153,14X14,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Screening Level AEC-Q100
Seated Height-Max 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Type MLC NAND TYPE
Width 11.5 mm

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