Part Details for TC582562AXB by Toshiba America Electronic Components
Overview of TC582562AXB by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for TC582562AXB
TC582562AXB CAD Models
TC582562AXB Part Data Attributes
|
TC582562AXB
Toshiba America Electronic Components
Buy Now
Datasheet
|
Compare Parts:
TC582562AXB
Toshiba America Electronic Components
IC 32M X 8 EEPROM 3V, 35 ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, PLASTIC, TFBGA-63, Programmable ROM
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA63,8X12,32 | |
Pin Count | 63 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.1.B.1 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 35 ns | |
Command User Interface | YES | |
Data Polling | NO | |
JESD-30 Code | R-PBGA-B63 | |
JESD-609 Code | e0 | |
Length | 11 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Sectors/Size | 2K | |
Number of Terminals | 63 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA63,8X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Page Size | 512 words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Seated Height-Max | 1.2 mm | |
Sector Size | 16K | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Toggle Bit | NO | |
Type | NAND TYPE | |
Width | 9 mm |
Alternate Parts for TC582562AXB
This table gives cross-reference parts and alternative options found for TC582562AXB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC582562AXB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
NAND256W3A0DZA6E | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | TC582562AXB vs NAND256W3A0DZA6E |
NAND256R3A2DZA1T | 32MX8 FLASH 1.8V PROM, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | STMicroelectronics | TC582562AXB vs NAND256R3A2DZA1T |
NAND256R3A1DZA6E | Flash, 32MX8, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | TC582562AXB vs NAND256R3A1DZA6E |
HY27US08561A-FPEP | Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, FBGA-63 | SK Hynix Inc | TC582562AXB vs HY27US08561A-FPEP |
K9F5608U0D-JCB00 | Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 | Samsung Semiconductor | TC582562AXB vs K9F5608U0D-JCB00 |
NAND256R3A1BZA6 | Flash, 32MX8, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | TC582562AXB vs NAND256R3A1BZA6 |
NAND256R3A0DZA6 | 32MX8 FLASH 1.8V PROM, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | STMicroelectronics | TC582562AXB vs NAND256R3A0DZA6 |
NAND256R3A1CZA1E | Flash, 32MX8, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | TC582562AXB vs NAND256R3A1CZA1E |
NAND256R3A3DZA1T | 32MX8 FLASH 1.8V PROM, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | STMicroelectronics | TC582562AXB vs NAND256R3A3DZA1T |
NAND256W3A1BZA6F | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | TC582562AXB vs NAND256W3A1BZA6F |