Datasheets
TE28F128J3D75A by:

Flash, 8MX16, 75ns, PDSO56

Part Details for TE28F128J3D75A by Micron Technology Inc

Overview of TE28F128J3D75A by Micron Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for TE28F128J3D75A

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TE28F128J3D75A Part Data Attributes

TE28F128J3D75A Micron Technology Inc
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TE28F128J3D75A Micron Technology Inc Flash, 8MX16, 75ns, PDSO56
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Micron
Access Time-Max 75 ns
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G56
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 16
Number of Sectors/Size 128
Number of Terminals 56
Number of Words 8388608 words
Number of Words Code 8000000
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP56,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 4/8 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00012 A
Supply Current-Max 0.08 mA
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit NO
Type NOR TYPE

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