Part Details for TMS27PC512-12FML by Rochester Electronics LLC
Overview of TMS27PC512-12FML by Rochester Electronics LLC
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Part Details for TMS27PC512-12FML
TMS27PC512-12FML CAD Models
TMS27PC512-12FML Part Data Attributes
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TMS27PC512-12FML
Rochester Electronics LLC
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Datasheet
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TMS27PC512-12FML
Rochester Electronics LLC
64KX8 OTPROM, 120ns, PQCC32, 0.050 INCH PITCH, PLASTIC PACKAGE-32
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| Pbfree Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | QFN | |
| Package Description | 0.050 INCH PITCH, PLASTIC PACKAGE-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 120 ns | |
| JESD-30 Code | R-PQCC-J32 | |
| JESD-609 Code | e0 | |
| Length | 13.97 mm | |
| Memory Density | 524288 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | NOT SPECIFIED | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 3.56 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11.43 mm |