Part Details for TMS32C6415EZLZ7E3 by Texas Instruments
Overview of TMS32C6415EZLZ7E3 by Texas Instruments
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for TMS32C6415EZLZ7E3
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | DIGITAL SIGNAL PROCESSOR, 32-BIT SIZE, 64-EXT BIT, 75.18MHZ, CMOS, PBGA532 | 16 |
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$186.1373 / $214.7738 | Buy Now |
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Rochester Electronics | TMS32C6415 - Digital Signal Processor, 32-Bit Size, 64-Ext Bit, 75.18MHz, PBGA532 RoHS: Not Compliant Status: Not Recommended for New Designs Min Qty: 1 | 578 |
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$190.8900 / $224.5800 | Buy Now |
Part Details for TMS32C6415EZLZ7E3
TMS32C6415EZLZ7E3 CAD Models
TMS32C6415EZLZ7E3 Part Data Attributes
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TMS32C6415EZLZ7E3
Texas Instruments
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Datasheet
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TMS32C6415EZLZ7E3
Texas Instruments
C64x fixed point DSP- up to 720MHz, McBSP, PCI 532-FCBGA 0 to 90
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Pbfree Code | Yes | |
Rohs Code | No | |
Part Life Cycle Code | Lifetime Buy | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-532 | |
Pin Count | 532 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Additional Feature | ALSO REQUIRES 3.3VI/O SUPPLY | |
Address Bus Width | 32 | |
Barrel Shifter | NO | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 75.18 MHz | |
External Data Bus Width | 64 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B532 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 4 | |
Number of DMA Channels | 64 | |
Number of External Interrupts | 4 | |
Number of Terminals | 532 | |
Number of Timers | 3 | |
Operating Temperature-Max | 90 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFBGA | |
Package Equivalence Code | BGA532,26X26,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (words) | 16384 | |
Seated Height-Max | 3.3 mm | |
Supply Current-Max | 125 mA | |
Supply Voltage-Max | 1.44 V | |
Supply Voltage-Min | 1.36 V | |
Supply Voltage-Nom | 1.4 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
Alternate Parts for TMS32C6415EZLZ7E3
This table gives cross-reference parts and alternative options found for TMS32C6415EZLZ7E3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS32C6415EZLZ7E3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TMS32C6415EGLZ7E3 | Fixed-Point Digital Signal Processor 532-FCBGA | Texas Instruments | TMS32C6415EZLZ7E3 vs TMS32C6415EGLZ7E3 |