| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| VND830LSP13TR | STMicroelectronics | Check for Price | Buffer/Inverter Based Peripheral Driver, 2 Driver, 23A, PDSO10 | VND830LSP vs VND830LSP13TR |
Part Details for VND830LSP by STMicroelectronics
Results Overview of VND830LSP by STMicroelectronics
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
VND830LSP Information
VND830LSP by STMicroelectronics is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for VND830LSP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
VND830LSP-ND
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DigiKey | IC PWR DRIVER N-CHAN 1:1 PWRSO10 Min Qty: 400 Container: Tube |
0 Tube |
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$2.2679 | Buy Now |
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Chip Stock | Buffer/Inverter Based Peripheral Driver, 2 Driver, 23A, PDSO10 | 768 |
|
RFQ | |
|
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Vyrian | Buffer/Inverter Based Peripheral Driver, 2 Driver, 23A, PDSO10 | 11327 |
|
RFQ |
US Tariff Estimator: VND830LSP by STMicroelectronics
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
VND830LSP CAD Models
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VND830LSP Part Data Attributes
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VND830LSP
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
VND830LSP
STMicroelectronics
Buffer/Inverter Based Peripheral Driver, 2 Driver, 23A, PDSO10
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | SOIC | |
| Package Description | Rohs Compliant, Power, So-10 | |
| Pin Count | 10 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.60 | |
| Built-in Protections | Over Current; Over Voltage; Under Voltage | |
| Driver Number of Bits | 2 | |
| Interface IC Type | Buffer Or Inverter Based Peripheral Driver | |
| JESD-30 Code | R-PDSO-G10 | |
| JESD-609 Code | e3 | |
| Length | 9.4 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Output Current Flow Direction | Sink | |
| Output Peak Current Limit-Nom | 23 A | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | HSOP | |
| Package Equivalence Code | SOP10,.55FL | |
| Package Shape | Rectangular | |
| Package Style | Small Outline, Heat Sink/Slug | |
| Peak Reflow Temperature (Cel) | 250 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.75 Mm | |
| Supply Voltage-Max | 36 V | |
| Supply Voltage-Min | 5.5 V | |
| Supply Voltage-Nom | 13 V | |
| Surface Mount | Yes | |
| Terminal Finish | Matte Tin | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Dual | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.5 Mm |
Alternate Parts for VND830LSP
This table gives cross-reference parts and alternative options found for VND830LSP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of VND830LSP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
VND830LSP Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN4979, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
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The VND830LSP has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
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The VND830LSP is rated for operation from -40°C to 150°C, but the maximum junction temperature (Tj) should not exceed 150°C. The device should be derated for temperatures above 125°C to ensure reliability.
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The VND830LSP can be programmed using the SPI interface. STMicroelectronics provides a programming guide and software tools, such as the STSW-VND830LSP, to help developers configure and program the device.
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The typical current consumption of the VND830LSP depends on the operating mode and frequency. According to the datasheet, the typical current consumption is around 10mA at 100kHz, but this can vary depending on the specific application and usage.