There are no models available for this part yet.
Overview of W25M02GVTCIG by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for W25M02GVTCIG by Winbond Electronics Corp
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
256-W25M02GVTCIG-ND
|
DigiKey | IC FLASH 2GBIT SPI/QUAD 24TFBGA Lead time: 28 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | ||
| Bristol Electronics | 940 |
|
RFQ | ||||
| Quest Components | FLASH, 1GX2, PBGA24 | 752 |
|
$5.6280 / $11.2560 | Buy Now | ||
| NAC | 2G-bit Serial NAND flash, 3V, TFBGA24 (8x6mm, 4x6 Ball Array) Package RoHS: Compliant Min Qty: 480 Package Multiple: 480 | 0 |
|
$4.6900 / $4.9400 | Buy Now |
CAD Models for W25M02GVTCIG by Winbond Electronics Corp
Part Data Attributes for W25M02GVTCIG by Winbond Electronics Corp
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
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Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
|
Package Description
|
TFBGA-24
|
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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|
HTS Code
|
8542.32.00.51
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|
Samacsys Manufacturer
|
Winbond
|
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Clock Frequency-Max (fCLK)
|
104 MHz
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JESD-30 Code
|
R-PBGA-B24
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Length
|
8 mm
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Memory Density
|
2147483648 bit
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Memory IC Type
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FLASH
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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24
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Number of Words
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268435456 words
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Number of Words Code
|
256000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
256MX8
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TBGA
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Package Shape
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RECTANGULAR
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Package Style
|
GRID ARRAY, THIN PROFILE
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Parallel/Serial
|
SERIAL
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Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
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Programming Voltage
|
3 V
|
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Seated Height-Max
|
1.2 mm
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Supply Voltage-Max (Vsup)
|
3.6 V
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Supply Voltage-Min (Vsup)
|
2.7 V
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Supply Voltage-Nom (Vsup)
|
3 V
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Surface Mount
|
YES
|
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Technology
|
CMOS
|
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
|
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Type
|
SLC NAND TYPE
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Width
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6 mm
|