Part Details for W25M512JWEIQ by Winbond Electronics Corp
Overview of W25M512JWEIQ by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W25M512JWEIQ
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
256-W25M512JWEIQ-ND
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DigiKey | IC FLASH 512MBIT SPI 8WSON Min Qty: 480 Lead time: 28 Weeks Container: Tray | Temporarily Out of Stock |
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$5.7285 | Buy Now |
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NAC | spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, WSON(8x6mm) Package RoHS: Compliant Min Qty: 480 Package Multiple: 480 | 0 |
|
$5.4100 / $5.6900 | Buy Now |
Part Details for W25M512JWEIQ
W25M512JWEIQ CAD Models
W25M512JWEIQ Part Data Attributes
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W25M512JWEIQ
Winbond Electronics Corp
Buy Now
Datasheet
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W25M512JWEIQ
Winbond Electronics Corp
Flash,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | WSON-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2018-10-01 | |
Samacsys Manufacturer | Winbond | |
Clock Frequency-Max (fCLK) | 104 MHz | |
JESD-30 Code | R-PDSO-N8 | |
Length | 8 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 6 mm |